| Mga Teknikal na Detalye ng MDI Modified Epoxy Resin | Paraan ng Pag-iimpake | Aplikasyon | |||||||||||||
| Modelo | Kulay | Form | Solid na Nilalaman (%) | EEW (g/eq) | Paglambot Point (℃) | Chromaticity (G/H) | Lagkit (mPa·s) | Hydrolyzable Chlorine (ppm) | Nilalaman ng Bromine (%) | Nilalaman ng Phosphorus (%) | Sample | ||||
| MDI binagong epoxy resin | Binagong brominated epoxy resin | EMTE8204 | Madilaw na Kayumanggi hanggang Mamula-mula Kayumanggi | likido | 74-76 | 335-365 | - | G:7-13 | 300-1000 | - | 16.5-18 | - | Tambol na bakal: 220kg/tambol | Flame-retardant printed circuit board substrates, electronic copper-clad boards, capacitor packaging, electrical laminates at iba pang lugar ng produkto. | |
| - | EMTE8205 | Banayad na Kayumanggi hanggang Madilaw na Kayumanggi | Solid | - | 280-320 | 65-75 | - | - | - | - | Paper bag na may panloob na PE liner:25 kg/bag. | Halogen-free flame-retardant printed circuit substrates, electronic copper-clad laminates, capacitor packaging, electrical laminates at iba pang lugar ng produkto. | |||
| EMTE 8205CK75 | Dilaw na Kayumanggi hanggang Pulang Kayumanggi | likido | 74-76 | 280-320 | - | G:8-12 | 500-2500 | ≤500 | - | Tambol na bakal: 220kg/tambol | |||||
