| Mga Teknikal na Detalye ng Epoxy Resin | Paraan ng Pag-iimpake | Aplikasyon | |||||||||||||
| Modelo | Kulay | Form | Solid na Nilalaman (%) | EEW (g/eq) | Paglambot Point (℃) | Chromaticity (G/H) | Lagkit (mPa·s) | Hydrolyzable Chlorine (ppm) | Nilalaman ng Bromine (%) | Nilalaman ng Phosphorus (%) | Sample | ||||
| Bisphenol F Epoxy Resin | Karaniwang bisphenol F type Epoxy resin solution | EMTE160 | Walang kulay to Banayad na Dilaw | likido | - | 155-165 | - | H≤20 | 1200-1600 | ≤150 | - | Iron drum:240kg/drum IBC package: 1000kg ISO tank package:22tons | Walang solvent na coatings, castings, adhesives, insulation materials at iba pang field. | ||
| EMTE170 | Walang kulay | 165-175 | G≤1 | 3500-4500 | ≤100 |  | |||||||||
| Binagong bisphenol F type Epoxy resin solution | EMTE 207K70 | Banayad na Dilaw hanggang Mamula-mula Kayumanggi | 70±1.0 | 500-600 | G＜8 | <3000 | <500 | - | Galvanized iron drum packaging: 220Kg. | Mga printed circuit board, electronic copper clad laminates, adhesives, composite materials, electrical laminates at iba pang lugar ng produkto. | |||||
